Ma nā pūʻulu maʻamau iā TO, ʻike ʻole ʻia ʻo Transistor Outline packages, he ʻelua ʻāpana kūkulu; kahi poʻo poʻo TO a me kahi pāpale TO. Mālama ka ʻāpana poʻo i ka loaʻa ʻana o ka mana i nā mea hermetically i hoʻopaʻa ʻia a ʻo ka pāpale e hoʻoliʻiliʻi i ka lawe ʻana o nā hōʻailona ʻōnika. Hana ʻia nā pūʻolo TO i ka iwi ʻaoʻao no ka hoʻouka ʻana i kahi ākea o nā ʻenehana a me nā uila uila mai nā huila uila maʻamau a hiki i nā semiconductors. Nā alakaʻi i huki ʻia ma o ka hale e lawe i ka mana i nā mea i hoʻopaʻa ʻia. ʻO ka hana o kēia mau ʻāpana i ke kumu o nā pūʻulu TO e like me ke diode kiʻi a me ka laser he mea nui ia no ka mea hiki i nā mea o ke kaiapuni ke kumu i ka pala ka mea e hiki ai ke hoʻohoka i ka mea āpau. ʻO kā Jitai ʻike ākea me ka hermeticity e lawe mai i nā ʻano hana encapsulation e hōʻoia i ka pale no nā mea i hoʻopaʻa ʻia a hiki iā lākou ke hana i kā lākou hana i manaʻo ʻia i loko o ka pūʻulu microelectronic no nā makahiki e hiki mai ana. Hana mākou i kahi laulā o nā ʻano maʻamau a me nā nui o TO pūʻolo. Loaʻa i kā mākou ʻoihana R&D nā mana piha e hana pū me nā mea kūʻai aku ma nā hopena pilikino. Hoʻopau kā mākou keʻena plating i loko o ka hale i ka hana hana, hāʻawi i nā mea kūʻai aku i nā ʻano electroless a me nā koho electrolytic plating e komo pū me Ni, Ni-Au, a me Ni-Ag.