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huahana

Mea Kuʻuna ʻole/Kōkua


Huahana Huahana

Puke Aluminum Alloy

NonconventionalSpecial Materials1

HO'A'A'ANA PUKU:
ʻO nā mea maikaʻi o ka alumini alumini kona kaumaha māmā, ikaika ikaika, a me ka maʻalahi hiki ke hoʻoheheʻe ʻia.E like me ia i hoʻohana nui ʻia i ka hana ʻana i ka ʻeke uila.

NA HI‘ONA NUI:
Kiʻekiʻe thermal conductivity
• Haʻahaʻa haʻahaʻa
Maikaʻi platability a workability, uwea oki, wili a me ka ili gula plating hiki ke hana.

HOIKE COEFFICIENT OF THERMAL EXPANSION/×10-6/K KA HOʻOHANA WĀMĀLĀ/W·(m·K)-1 KA NUI O/g·cm-3
A1 6061 22.6 210 2.7
A1 4047 21.6 193 2.6

Aluminum Silicon Metala Puke

Aluminum Silicon Metal Packages

HO'A'A'ANA PUKU:
ʻO nā alloys Si/Al no nā pūʻolo uila e pili nui ana i nā mea hoʻoheheʻe eutectic me kahi maʻi silika o 11% a 70%.He haʻahaʻa kona density, hiki ke hoʻohālikelike ʻia ka coefficient o ka hoʻonui ʻana i ka wela me ka chip a me ka substrate, a ʻoi aku ka maikaʻi o kona hiki ke hoʻopau i ka wela.He kūpono hoʻi kāna hana machining.ʻO ka hopena, loaʻa i nā alloys Si/Al ka mana nui i ka ʻoihana hoʻopili uila.

NA HI‘ONA NUI:
• Hiki ke hoʻopau i nā pilikia hoʻoheheʻe wela i ka hoʻomohala ʻana i nā mea mana kiʻekiʻe.
Hiki ke hoʻopaʻa ʻia ka coefficient o ka hoʻonui ʻana i ka wela, kahi e hiki ai ke hoʻohālikelike i ka puʻupuʻu, e pale aku i ke koʻikoʻi wela e hiki ke hoʻopau i ka hāmeʻa.
• Haʻahaʻa haʻahaʻa

ʻO CE Alloy ka inoa haku mele CTE,ppm/℃,25-100℃ ʻO ka mānoanoa, g/cm3 ʻO ka wela wela ma 25 ℃ W/mK Ka ikaika Bend,MPa Ka ikaika o ka hua, MPa Elastic Modulus,GPa
CE20 Al-12%Si 20 2.7
CE17 Al-27%Si 16 2.6 177 210 183 92
CE17M Al-27%Si* 16 2.6 147 92
CE13 Al-42%Si 12.8 2.55 160 213 155 107
CE11 Si-50%Al 11 2.5 149 172 125 121
CE9 Si-40%Al 9 2.45 129 140 134 124
CE7 Si-30%Al 7.4 2.4 120 143 100 129

Diamond/Copper, Diamond/Alumiuma

DiamondCopper, DiamondAluminum

HO'A'A'ANA PUKU:
ʻO Diamond/Copper a me Diamond/Aluminum nā mea i hui pū ʻia me ke daimana e like me ka pae hoʻoikaika a me ke keleawe a i ʻole alumini ka mea matrix.ʻO kēia nā mea hoʻokūkū hoʻokūkū a hoʻohiki hoʻi i nā mea hoʻopihapiha uila.No nā daimana / keleawe a me daimana / alumini metala hale, ka thermal conductivity o ka chip wahi mea ≥500W/(m•K) -1, e hoʻomāʻona i ka hana koi o kiʻekiʻe wela dissipation o ke kaapuni.Me ka hoʻonui mau ʻana o ka noiʻi, e pāʻani ana kēia mau ʻano hale i kahi hana koʻikoʻi i ke kahua o ka ʻeke uila.

NA HI‘ONA NUI:
•Kiʻekiʻe thermal conductivity
• Hiki ke ho'omalu 'ia ka coefficient o ka ho'onui wela (CTE) ma ka ho'ololi 'ana i ka hakina nui o ke daimana a me nā mea Cu.
• Haʻahaʻa haʻahaʻa
• Maikaʻi platability a workability, oki uwea, wili a me ka ili gula plating hiki ke lawe

HOIKE COEFFICIENT OF THERMAL EXPANSION/×10-4/K KA HANA WĀMĀLĀ/W·(m·K)-1 KA NUI O/g·cm-3
DIAMOND60%-COPPER40% 4 600 4.6
DIAMOND40%-COPPER60% 6 550 5.1
DIAMOND ALUMINIUM 7 >450 3.2

AlN pani

AlN substrate

HO'A'A'ANA PUKU:
ʻO ka alumini nitride ceramic kahi mea ʻenehana seramika.Loaʻa iā ia nā waiwai wela, mechanical a me nā uila, e like me ka conductivity uila kiʻekiʻe, kahi liʻiliʻi liʻiliʻi liʻiliʻi dielectric mau, kahi linear expansion coefficient matching silicon, insulation uila maikaʻi loa, a haʻahaʻa haʻahaʻa.ʻAʻohe mea ʻawaʻawa a ikaika.Me ka hoʻonui nui ʻana o nā mea microelectronic, ʻo nā seramika nitride aluminika ma ke ʻano he kumu kumu a i ʻole no ka hale o ka pūʻolo, ua lilo i mea kaulana.He mea hoʻohiki mana kiʻekiʻe i hoʻohui ʻia ka substrate kaiapuni a me nā mea hoʻopili.

NA HI‘ONA NUI:
•Ka wela wela (ma kahi o 270W/m•K), kokoke i BeO a me SiC, a oi aku mamua o 5 manawa o Al2O3
• 'O ke koena ho'onui wela e pili ana i ka Si a me GaA
• ʻO nā waiwai uila maikaʻi loa (mau liʻiliʻi liʻiliʻi liʻiliʻi, nalowale dielectric, resistivity volume, ikaika dielectric)
•Ka ikaika mechanical kiʻekiʻe a me ka hana machining kūpono
• ʻO nā hiʻohiʻona optical a me ka microwave kūpono
• ʻAʻole ʻona


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