Nā Pono Hana Hou / Kūpono
Paka ʻĀpana Aluminium
HAKAKA POKOLE:
ʻO nā mea maikaʻi o ke kinikini aluminika kona māmā māmā, ikaika ikaika, a me ka maʻalahi e hiki ai ke hoʻopili ʻia. E like me ia e hoʻohana ākea ʻia i ka hana ʻana i nā uila uila.
KEKAHI MAIN:
ʻO ke alakaʻi wela wela kiʻekiʻe
• Ka haʻahaʻa haʻahaʻa
• Maikaʻi platability a me ka workability, uea ana, wili a me ka honua gula plating hiki ke hoʻokō 'ia.
| KELKAHI MEA | COEFFICIENT OF THERMAL EXPANSION / × 10-6 / K | THERMAL CONDUCTIVITY / W · (m · K)-1 | KE KAHI O / g · cm-3 |
| A1 6061 | 22.6 | 210 | 2.7 |
| A1 4047 | 21.6 | 193 | 2.6 |
Nā Pahu ʻAilana Silicon Aluminium
HAKAKA POKOLE:
ʻO nā kinikini Si / Al no nā pūʻulu uila e kuhikuhi nui i nā pono hana eutectic me kahi ʻike silicon o 11% a 70%. Haʻahaʻa kona kiʻiona, hiki ke hoʻohālikelike ʻia ke koina o ka hoʻonui ʻana i ka wela a me ka substrate, a ʻo kona hiki ke hoʻopau i ka wela maikaʻi loa. Kūpono hoʻi kāna hana mīkini. ʻO ka hopena, loaʻa i nā ʻāpana Si / Al ka nui loa i ka ʻoihana uila uila.
KEKAHI MAIN:
• hiki i ka hoʻopau wela wikiwiki a me ka conductivity wela kiʻekiʻe ke hoʻonā i nā pilikia hoʻopau wela i pili i ka hoʻomohala ʻana i nā hāmeʻa mana kiʻekiʻe.
• Hiki ke kāohi ʻia ke koina o ka hoʻonui ʻana o ka mehana, a he mea ia e kūlike ai me ka ʻāpana, e ʻalo nei i ka nui o ke koʻikoʻi wela e hiki ai ke holo pono ʻole ka hāmeʻa.
• Ka haʻahaʻa haʻahaʻa
| Ke koho ʻana o Alloy | Hoʻohui kinikini | CTE ， ppm / ℃ ， 25-100 ℃ | Ka nui, g / cm3 | Thermal Conductivity ma 25 ℃ W / mK | Ikaika Bend, MPa | Ka ikaika e loaʻa ai, MPa | Hoʻolālā Elastic, GPa |
| CE20 | Al-12% Si | 20 | 2.7 | ||||
| CE17 | Al-27% Si | 16 | 2.6 | 177 | 210 | 183 | 92 |
| CE17M | Al-27% Si * | 16 | 2.6 | 147 | 92 | ||
| CE13 | Al-42% Si | 12.8 | 2.55 | 160 | 213 | 155 | 107 |
| CE11 | Si-50% Al | 11 | 2.5 | 149 | 172 | 125 | 121 |
| CE9 | Si-40% Al | 9 | 2.45 | 129 | 140 | 134 | 124 |
| CE7 | Si-30% Al | 7.4 | 2.4 | 120 | 143 | 100 | 129 |
Daimana / keleawe, Daimana / Aluminum
HAKAKA POKOLE:
ʻO Diamond / Copper a me Diamond / Aluminium nā mea i hoʻohui ʻia me ke daimana e like me ka hoʻoikaika ʻana a me ke keleawe a me ke alumini e like me ka matrix material. ʻO kēia mau mea hoʻokūkū a hoʻohiki hoʻi i nā lako uila uila. No nā hale daimana / keleawe a me ke daimana / aluminika, ʻo ka conductivity thermal o ka ʻāpana chip he ≥500W / (m • K) -1, e ʻoluʻolu ana i nā koina hana o ka hoʻopau wela nui o ke kaapuni. Me ka hoʻonui mau o ka noiʻi, e lilo kēia ʻano ʻano hale i mea nui i ka hana o ka uila uila.
KEKAHI MAIN:
• Uila wela kiʻekiʻe
• Hiki ke kaʻi ʻia ka mea hoʻonui o ka hoʻonui wela (CTE) ma o ka hoʻololi ʻana i ka hapa nui o nā mea daimana a me Cu
• Ka haʻahaʻa haʻahaʻa
• Maikaʻi platability a me ka workability, uea ana, wili a me ka honua gula plating hiki ke lawe mai
| KELKAHI MEA | COEFFICIENT OF THERMAL EXPANSION / × 10-4 / K | KA HANA HANA ANA / W · (m · K) -1 | KA MEA O / g · cm-3 |
| DIAMOND60% -COPPER40% | 4 | 600 | 4.6 |
| DIAMOND40% -COPPER60% | 6 | 550 | 5.1 |
| ALAMINUMA DIAMOND | 7 | > 450 | 3.2 |
Palapala honua AlN
HAKAKA POKOLE:
ʻO ka pālolo nitride aluminika kahi mea hana ʻenehana. Loaʻa iā ia nā mehana, mechanical a me nā pono uila, e like me ka conductivity uila kiʻekiʻe, kahi liʻiliʻi o ka dielectric pili mau, kahi coefficient linear hoʻonui like me ka silikone, kahi uila uila maikaʻi, a me ka haʻahaʻa haʻahaʻa. ʻAʻole ona ʻona ia a ikaika. Me ka hoʻomohala ākea o nā hāmeʻa microelectronic, ʻo nā aluminika nitride ceramics ma ke ʻano he kumuwaiwai a i ʻole no ka hale o ka pūʻolo, ua lilo i mea makemake nui ʻia. ʻO ia ka hoʻohiki kiʻekiʻe-mana hoʻohui kaapuni substrate a me ka hāʻawe mea.
KEKAHI MAIN:
• Uila wela kiʻekiʻe (ma kahi o 270W / m • K), kokoke iā BeO a me SiC, a ʻoi aku ma mua o 5 mau manawa o Al2O3
• Kūlike ka coefficient hoʻomālua hoʻomehana me Si a me GaAs
• Nā pono uila maikaʻi (kū mau ka dielectric liʻiliʻi, nalowale dielectric, resistivity volume, ikaika dielectric)
• Ka ikaika mechanical kiʻekiʻe a me ka hana mīkini maikaʻi
• ʻO nā hiʻohiʻona opua a me nā microwave maikaʻi
• Pākuʻi ʻole
