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Nā Pono Hana Hou / Kūpono


ʻIke kikoʻī

Paka ʻĀpana Aluminium

NonconventionalSpecial Materials1

HAKAKA POKOLE:
ʻO nā mea maikaʻi o ke kinikini aluminika kona māmā māmā, ikaika ikaika, a me ka maʻalahi e hiki ai ke hoʻopili ʻia. E like me ia e hoʻohana ākea ʻia i ka hana ʻana i nā uila uila.

KEKAHI MAIN:
ʻO ke alakaʻi wela wela kiʻekiʻe
• Ka haʻahaʻa haʻahaʻa
• Maikaʻi platability a me ka workability, uea ana, wili a me ka honua gula plating hiki ke hoʻokō 'ia.

KELKAHI MEA COEFFICIENT OF THERMAL EXPANSION / × 10-6 / K THERMAL CONDUCTIVITY / W · (m · K)-1 KE KAHI O / g · cm-3
A1 6061 22.6 210 2.7
A1 4047 21.6 193 2.6

Nā Pahu ʻAilana Silicon Aluminium

Aluminum Silicon Metal Packages

HAKAKA POKOLE:
ʻO nā kinikini Si / Al no nā pūʻulu uila e kuhikuhi nui i nā pono hana eutectic me kahi ʻike silicon o 11% a 70%. Haʻahaʻa kona kiʻiona, hiki ke hoʻohālikelike ʻia ke koina o ka hoʻonui ʻana i ka wela a me ka substrate, a ʻo kona hiki ke hoʻopau i ka wela maikaʻi loa. Kūpono hoʻi kāna hana mīkini. ʻO ka hopena, loaʻa i nā ʻāpana Si / Al ka nui loa i ka ʻoihana uila uila.

KEKAHI MAIN:
• hiki i ka hoʻopau wela wikiwiki a me ka conductivity wela kiʻekiʻe ke hoʻonā i nā pilikia hoʻopau wela i pili i ka hoʻomohala ʻana i nā hāmeʻa mana kiʻekiʻe.
• Hiki ke kāohi ʻia ke koina o ka hoʻonui ʻana o ka mehana, a he mea ia e kūlike ai me ka ʻāpana, e ʻalo nei i ka nui o ke koʻikoʻi wela e hiki ai ke holo pono ʻole ka hāmeʻa.
• Ka haʻahaʻa haʻahaʻa

Ke koho ʻana o Alloy Hoʻohui kinikini CTE , ppm / ℃ , 25-100 ℃ Ka nui, g / cm3 Thermal Conductivity ma 25 ℃ W / mK Ikaika Bend, MPa Ka ikaika e loaʻa ai, MPa Hoʻolālā Elastic, GPa
CE20 Al-12% Si 20 2.7
CE17 Al-27% Si 16 2.6 177 210 183 92
CE17M Al-27% Si * 16 2.6 147 92
CE13 Al-42% Si 12.8 2.55 160 213 155 107
CE11 Si-50% Al 11 2.5 149 172 125 121
CE9 Si-40% Al 9 2.45 129 140 134 124
CE7 Si-30% Al 7.4 2.4 120 143 100 129

Daimana / keleawe, Daimana / Aluminum

DiamondCopper, DiamondAluminum

HAKAKA POKOLE:
ʻO Diamond / Copper a me Diamond / Aluminium nā mea i hoʻohui ʻia me ke daimana e like me ka hoʻoikaika ʻana a me ke keleawe a me ke alumini e like me ka matrix material. ʻO kēia mau mea hoʻokūkū a hoʻohiki hoʻi i nā lako uila uila. No nā hale daimana / keleawe a me ke daimana / aluminika, ʻo ka conductivity thermal o ka ʻāpana chip he ≥500W / (m • K) -1, e ʻoluʻolu ana i nā koina hana o ka hoʻopau wela nui o ke kaapuni. Me ka hoʻonui mau o ka noiʻi, e lilo kēia ʻano ʻano hale i mea nui i ka hana o ka uila uila.

KEKAHI MAIN:
• Uila wela kiʻekiʻe
• Hiki ke kaʻi ʻia ka mea hoʻonui o ka hoʻonui wela (CTE) ma o ka hoʻololi ʻana i ka hapa nui o nā mea daimana a me Cu
• Ka haʻahaʻa haʻahaʻa
• Maikaʻi platability a me ka workability, uea ana, wili a me ka honua gula plating hiki ke lawe mai

KELKAHI MEA COEFFICIENT OF THERMAL EXPANSION / × 10-4 / K KA HANA HANA ANA / W · (m · K) -1 KA MEA O / g · cm-3
DIAMOND60% -COPPER40% 4 600 4.6
DIAMOND40% -COPPER60% 6 550 5.1
ALAMINUMA DIAMOND 7 > 450 3.2

Palapala honua AlN

AlN substrate

HAKAKA POKOLE:
ʻO ka pālolo nitride aluminika kahi mea hana ʻenehana. Loaʻa iā ia nā mehana, mechanical a me nā pono uila, e like me ka conductivity uila kiʻekiʻe, kahi liʻiliʻi o ka dielectric pili mau, kahi coefficient linear hoʻonui like me ka silikone, kahi uila uila maikaʻi, a me ka haʻahaʻa haʻahaʻa. ʻAʻole ona ʻona ia a ikaika. Me ka hoʻomohala ākea o nā hāmeʻa microelectronic, ʻo nā aluminika nitride ceramics ma ke ʻano he kumuwaiwai a i ʻole no ka hale o ka pūʻolo, ua lilo i mea makemake nui ʻia. ʻO ia ka hoʻohiki kiʻekiʻe-mana hoʻohui kaapuni substrate a me ka hāʻawe mea.

KEKAHI MAIN:
• Uila wela kiʻekiʻe (ma kahi o 270W / m • K), kokoke iā BeO a me SiC, a ʻoi aku ma mua o 5 mau manawa o Al2O3
• Kūlike ka coefficient hoʻomālua hoʻomehana me Si a me GaAs
• Nā pono uila maikaʻi (kū mau ka dielectric liʻiliʻi, nalowale dielectric, resistivity volume, ikaika dielectric)
• Ka ikaika mechanical kiʻekiʻe a me ka hana mīkini maikaʻi
• ʻO nā hiʻohiʻona opua a me nā microwave maikaʻi
• Pākuʻi ʻole


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