Mea Kuʻuna ʻole/Kōkua
Puke Aluminum Alloy
HO'A'A'ANA PUKU:
ʻO nā mea maikaʻi o ka alumini alumini kona kaumaha māmā, ikaika ikaika, a me ka maʻalahi hiki ke hoʻoheheʻe ʻia.E like me ia i hoʻohana nui ʻia i ka hana ʻana i ka ʻeke uila.
NA HI‘ONA NUI:
Kiʻekiʻe thermal conductivity
• Haʻahaʻa haʻahaʻa
Maikaʻi platability a workability, uwea oki, wili a me ka ili gula plating hiki ke hana.
| HOIKE | COEFFICIENT OF THERMAL EXPANSION/×10-6/K | KA HOʻOHANA WĀMĀLĀ/W·(m·K)-1 | KA NUI O/g·cm-3 |
| A1 6061 | 22.6 | 210 | 2.7 |
| A1 4047 | 21.6 | 193 | 2.6 |
Aluminum Silicon Metala Puke
HO'A'A'ANA PUKU:
ʻO nā alloys Si/Al no nā pūʻolo uila e pili nui ana i nā mea hoʻoheheʻe eutectic me kahi maʻi silika o 11% a 70%.He haʻahaʻa kona density, hiki ke hoʻohālikelike ʻia ka coefficient o ka hoʻonui ʻana i ka wela me ka chip a me ka substrate, a ʻoi aku ka maikaʻi o kona hiki ke hoʻopau i ka wela.He kūpono hoʻi kāna hana machining.ʻO ka hopena, loaʻa i nā alloys Si/Al ka mana nui i ka ʻoihana hoʻopili uila.
NA HI‘ONA NUI:
• Hiki ke hoʻopau i nā pilikia hoʻoheheʻe wela i ka hoʻomohala ʻana i nā mea mana kiʻekiʻe.
Hiki ke hoʻopaʻa ʻia ka coefficient o ka hoʻonui ʻana i ka wela, kahi e hiki ai ke hoʻohālikelike i ka puʻupuʻu, e pale aku i ke koʻikoʻi wela e hiki ke hoʻopau i ka hāmeʻa.
• Haʻahaʻa haʻahaʻa
| ʻO CE Alloy ka inoa | haku mele | CTE，ppm/℃，25-100℃ | ʻO ka mānoanoa, g/cm3 | ʻO ka wela wela ma 25 ℃ W/mK | Ka ikaika Bend，MPa | Ka ikaika o ka hua, MPa | Elastic Modulus，GPa |
| CE20 | Al-12%Si | 20 | 2.7 | ||||
| CE17 | Al-27%Si | 16 | 2.6 | 177 | 210 | 183 | 92 |
| CE17M | Al-27%Si* | 16 | 2.6 | 147 | 92 | ||
| CE13 | Al-42%Si | 12.8 | 2.55 | 160 | 213 | 155 | 107 |
| CE11 | Si-50%Al | 11 | 2.5 | 149 | 172 | 125 | 121 |
| CE9 | Si-40%Al | 9 | 2.45 | 129 | 140 | 134 | 124 |
| CE7 | Si-30%Al | 7.4 | 2.4 | 120 | 143 | 100 | 129 |
Diamond/Copper, Diamond/Alumiuma
HO'A'A'ANA PUKU:
ʻO Diamond/Copper a me Diamond/Aluminum nā mea i hui pū ʻia me ke daimana e like me ka pae hoʻoikaika a me ke keleawe a i ʻole alumini ka mea matrix.ʻO kēia nā mea hoʻokūkū hoʻokūkū a hoʻohiki hoʻi i nā mea hoʻopihapiha uila.No nā daimana / keleawe a me daimana / alumini metala hale, ka thermal conductivity o ka chip wahi mea ≥500W/(m•K) -1, e hoʻomāʻona i ka hana koi o kiʻekiʻe wela dissipation o ke kaapuni.Me ka hoʻonui mau ʻana o ka noiʻi, e pāʻani ana kēia mau ʻano hale i kahi hana koʻikoʻi i ke kahua o ka ʻeke uila.
NA HI‘ONA NUI:
•Kiʻekiʻe thermal conductivity
• Hiki ke ho'omalu 'ia ka coefficient o ka ho'onui wela (CTE) ma ka ho'ololi 'ana i ka hakina nui o ke daimana a me nā mea Cu.
• Haʻahaʻa haʻahaʻa
• Maikaʻi platability a workability, oki uwea, wili a me ka ili gula plating hiki ke lawe
| HOIKE | COEFFICIENT OF THERMAL EXPANSION/×10-4/K | KA HANA WĀMĀLĀ/W·(m·K)-1 | KA NUI O/g·cm-3 |
| DIAMOND60%-COPPER40% | 4 | 600 | 4.6 |
| DIAMOND40%-COPPER60% | 6 | 550 | 5.1 |
| DIAMOND ALUMINIUM | 7 | >450 | 3.2 |
AlN pani
HO'A'A'ANA PUKU:
ʻO ka alumini nitride ceramic kahi mea ʻenehana seramika.Loaʻa iā ia nā waiwai wela, mechanical a me nā uila, e like me ka conductivity uila kiʻekiʻe, kahi liʻiliʻi liʻiliʻi liʻiliʻi dielectric mau, kahi linear expansion coefficient matching silicon, insulation uila maikaʻi loa, a haʻahaʻa haʻahaʻa.ʻAʻohe mea ʻawaʻawa a ikaika.Me ka hoʻonui nui ʻana o nā mea microelectronic, ʻo nā seramika nitride aluminika ma ke ʻano he kumu kumu a i ʻole no ka hale o ka pūʻolo, ua lilo i mea kaulana.He mea hoʻohiki mana kiʻekiʻe i hoʻohui ʻia ka substrate kaiapuni a me nā mea hoʻopili.
NA HI‘ONA NUI:
•Ka wela wela (ma kahi o 270W/m•K), kokoke i BeO a me SiC, a oi aku mamua o 5 manawa o Al2O3
• 'O ke koena ho'onui wela e pili ana i ka Si a me GaA
• ʻO nā waiwai uila maikaʻi loa (mau liʻiliʻi liʻiliʻi liʻiliʻi, nalowale dielectric, resistivity volume, ikaika dielectric)
•Ka ikaika mechanical kiʻekiʻe a me ka hana machining kūpono
• ʻO nā hiʻohiʻona optical a me ka microwave kūpono
• ʻAʻole ʻona
